Oct 22 (Reuters) – BE Semiconductor Industries reported third-quarter orders that exceeded analyst expectations on Thursday, as demand for its chip-packaging equipment tied to AI data centres remained strong.
Quarterly order intake, the industry’s most closely watched metric, was €342.6 million ($385.2 million), up 17% from the second quarter and 96% from a year ago. Analysts polled by researcher Visible Alpha had expected €298 million.
“Favorable order momentum in the first nine months of this year should continue in Q4-26 as the multi year AI capacity build-out progresses,” CEO Richard Blickman said in the earnings statement.
Orders at Besi are lumpy from quarter to quarter. The company’s shares have fallen sharply in recent months on worries that chipmakers will be slower than expected to adopt its hybrid bonding technology, which stacks chips directly on top of each other.
($1 = 0.8894 euros)
(Reporting by Nathan Vifflin in Gdansk, editing by Milla Nissi-Prussak)
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